Device for soldering/desoldering apertured lendless packages

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 19, 228 51, 219230, B23K 302

Patent

active

045181101

ABSTRACT:
A solder/desolder tool has a heater block supporting a handle at its upper end and a heating plate at its lower end. The heating plate is thermally engaged by heating elements housed in the heater block. An array of pin relief apertures are formed in the heating plate. Retractable clamps are pivoted to the heater block for clamping a leadless chip against the heating plate. The leadless chip has an array of input/output sockets corresponding to the array of pin relief apertures. A method is disclosed for soldering the chip sockets to a corresponding array of pins supported by a PC board. According to the method, solder balls are loaded in the chip sockets, and the chip is then secured in the tool to reflow the solder balls to form solder plugs. The solder plugs are then set upon the upper ends of the pins and melted by the heating plate so that solder joints are formed between the pins and sockets. The chip is released from the tool to allow the solder joints to cool. A desoldering method is disclosed wherein the tool is secured to a chip which is in a soldered condition (i.e., the chip sockets are soldered to the pins). The heating plate applies heat to the solder joints about the individual circumferences of the pins. Once the solder joints reach reflow temperature, the chip can be removed from the pins.

REFERENCES:
patent: 2293455 (1941-09-01), Disch et al.
patent: 3050612 (1962-08-01), Eversole
patent: 3407985 (1978-10-01), Miller
patent: 3552630 (1971-01-01), Dean
patent: 3576969 (1971-05-01), Surty
patent: 3582610 (1971-01-01), Eckles
patent: 3632036 (1972-01-01), Halstead
patent: 3632973 (1972-01-01), O'Keefe
patent: 3649809 (1972-03-01), Halstead
patent: 3746239 (1973-07-01), Auray
patent: 3766623 (1973-10-01), Lerner et al.
patent: 3990863 (1976-11-01), Palmer
patent: 4066204 (1978-01-01), Wirbser et al.
patent: 4136444 (1979-01-01), Durney
patent: 4274576 (1981-06-01), Shariff
Scrupski, "Part One-Plastic-Ceramic LSI Package Design Concepts",_Electronics, Apr. 12, 1971, pp. 75-86.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Device for soldering/desoldering apertured lendless packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for soldering/desoldering apertured lendless packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for soldering/desoldering apertured lendless packages will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1533852

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.