Thermal measuring and testing – Determination of inherent thermal property
Patent
1996-05-22
2000-03-21
Bennett, G. Bradley
Thermal measuring and testing
Determination of inherent thermal property
G01N 2520
Patent
active
060394714
ABSTRACT:
The junction temperature of a die inside an electronic component is empirically determined by use of a board simulator that simulates a target board on which the electronic component is to be operated. The board simulator includes a thermoelectric cooler used to electrically control the board simulator's thermal resistivity. The board simulator's thermal resistivity is determined in a first calibration step by measuring the difference in temperatures between two thermocouples mounted on two sides of the board simulator. Then, the board simulator is attached to a test component that includes a heating element and a temperature sensor. In a second calibration step, for a known thermal power generated by the heating element, the junction temperature of the test component is measured for different values of thermal resistivity of the board simulator. Next in a measurement step, the user determines the thermal resistivity of the target board. Then the user uses the measured resistivity to look up the junction temperature of the test component from the calibration measurements, which is the estimated junction temperature of the electronic component. The board simulator includes a heat sink, a peltier device coupled to the heat sink and an optional coupon coupled to the peltier device. The coupon can be formed of the same material as the target board, or of a different material of a known thermal conductivity.
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Bennett G. Bradley
Integrated Device Technology Inc.
Verbitsky Gail
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