Device for separating wafers and process for using said device

Details Device for separating wafers and process for using said device Device for separating wafers and process for using said device

1997-07-23

2000-06-20

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 29239, 294265, B32B 3500

Patent

active

060773839

ABSTRACT:
A device for the separation of wafers bonded by forces of attraction. The device includes at least one assembly of at least two flexible elements whose width in a direction perpendicular to the planes of the wafers is less than the largest gap between the ends of the wafers.

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