Device for selective plating of electrical contacts for...

Details Device for selective plating of electrical contacts for... Device for selective plating of electrical contacts for...

2009-11-02

2010-11-30

Wilkins, III, Harry D (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S275100, C205S118000, C205S122000, C205S128000, C205S131000, C205S134000

Reexamination Certificate

active

07842170

ABSTRACT:
This invention relates generally to a method and apparatus for electroplating selected portions of a high contact force, high elastic response range pin-receiving and cylindrical electrical contact having a pair of spaced apart cantilever beams which extend forwardly from a base to a pin-receiving end. In accordance with the invention at least one plating cell is provided including a cavity type of enclosure thereof in general matching the outer contour of the lower portion and pin receiving end of the contact whereas plating solution is ejected towards the pin receiving end including at least one conducting device for electric current is provided adjacent to the opposite region of the contact for engaging with thereof whereas electric current is being conducted.

REFERENCES:
patent: 4153523 (1979-05-01), Koontz et al.
patent: 4278520 (1981-07-01), Turner
patent: 4280882 (1981-07-01), Hovey
patent: 4427498 (1984-01-01), Wagner
patent: 4473445 (1984-09-01), Smith et al.
patent: 4904364 (1990-02-01), Davis et al.
patent: 5180482 (1993-01-01), Abys et al.
patent: 5372700 (1994-12-01), Pilorge et al.
patent: 7070688 (2006-07-01), Donovan, III
patent: 2008/0006526 (2008-01-01), von Detten

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