Device for securing an electronic component to a pin grid array

Metal fusion bonding – Process – Plural joints

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228189, 29840, H05K 334

Patent

active

056999542

ABSTRACT:
The present invention is directed to a device for securing an electrical component to a pin grid array (PGA) socket that has a substantially planar body portion and a plurality of conductor pins, which are electrically connectable to a circuit board and project outwardly in a direction substantially perpendicular to the planar body portion. The device comprises a base member that has a plurality of conductor pin apertures which extend through the base member. Each of the conductor pin apertures are registered to receive therethrough a corresponding one of the plurality of conductor pins, to thereby sandwich the base member between and anchor the base member to the circuit board and the PGA socket when the PGA socket is electrically connected to the circuit board. The device further comprises a means for releasably securing the electrical component to the PGA socket. The means is coupled to the base member and a surface of the electrical component and transmits a retaining force from the base member to the electrical component, thereby substantially preventing the electrical component from separating from the PGA socket.

REFERENCES:
patent: 4985989 (1991-01-01), Murphy
patent: 5140745 (1992-08-01), McKenzie, Jr.
patent: 5241453 (1993-08-01), Bright et al.

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