Cleaning and liquid contact with solids – Processes – Including regeneration – purification – recovery or separation...
Patent
1994-05-17
1996-05-28
Stinson, Frankie L.
Cleaning and liquid contact with solids
Processes
Including regeneration, purification, recovery or separation...
134 254, 134 952, 1341021, 1341023, 134902, B08B 1500
Patent
active
055207448
ABSTRACT:
Deionized water is supplied into a rinsing bath from its bottom portion and overflows from the upper portion of the rinsing bath to form an upflow of deionized water in the rinsing bath. A substrate is rinsed by being immersed in the upflow of deionized water. After rinsing, the substrate is removed from deionized water, and at this tim the surroundings of the substrate are supplied with vapor of an organic solvent soluble in water which serves to lower surface tension of deionized water to the substrate. Thereafter, the substrate is dried in a sealed chamber that is evacuated and the surroundings of the substrate are reduced in pressure. As a result, during drying the substrate surface after rinsing same with deionized water, it is possible to reduce adhesion of particles to the substrate surface, and to dry the substrate surface rapidly without heating the substrate.
REFERENCES:
patent: 4714086 (1987-12-01), Kishida et al.
patent: 4736758 (1988-04-01), Kusuhara
patent: 5158100 (1992-10-01), Tanaka et al.
patent: 5273589 (1993-12-01), Griswold et al.
patent: 5301701 (1994-04-01), Nafziga
patent: 5331987 (1994-07-01), Hayashi et al.
patent: 5361789 (1994-11-01), Yoshida et al.
Fujikawa Kazonori
Muraoka Yusuke
Tanaka Masato
Dainippon Screen Manufacturing Co. Ltd.
Stinson Frankie L.
LandOfFree
Device for rinsing and drying substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Device for rinsing and drying substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for rinsing and drying substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-783530