Device for removing an injection molded substrate from an...

Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under... – With product ejector

Reexamination Certificate

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Details

C425S315000, C425S444000, C425S806000, C425S810000

Reexamination Certificate

active

10829923

ABSTRACT:
A device for removing an injection-molded substrate with attached sprue from an injection mold having half-molds, in particular a substrate for optical data carriers, includes a lever that can swing in and out of a position between the half-molds of the injection mold and is constructed to include a substrate retaining mechanism with a substrate retaining member with a recess or an opening sized to hold the substrate and configured to receive the sprue with a pass fit. The substrate retaining member secures the substrate in place as the lever swings in and out of the open half-molds. An injection molding machine using the device is also described. The substrate can be quickly demolded and the sprue removed in a single operation without producing dust in the mold.

REFERENCES:
patent: 4738613 (1988-04-01), Eichlseder et al.
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patent: 28 38 634 (1979-05-01), None
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patent: 04067924 (1992-03-01), None
patent: 06-198986 (1994-07-01), None
patent: 06 315957 (1994-11-01), None
patent: 07 205220 (1995-08-01), None
patent: 2000 235740 (2000-08-01), None
patent: 2000 334787 (2000-12-01), None
patent: WO 94 19 166 (1994-09-01), None
English abstract for JP 06-198686.
English abstract and computer translation for JP 2000-334787.

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