Device for receiving components, particularly integrated chips,

Details Device for receiving components, particularly integrated chips, Device for receiving components, particularly integrated chips,

1985-12-17

1987-03-17

Levy, Stewart J.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324 73PC, G01R 3128

Patent

active

046510907

ABSTRACT:
In a device for receiving components (8', 8", 8"'), particularly integrated chips, in receiving portions (15, 19, 20, 21, 22) of an input and/or output magazine of a component testing machine, with a testing device, the receiving portions are formed by providing grooves for each portion, in a support plate (14), at a distance corresponding to the varying distance between connections of the components to be received.

REFERENCES:
patent: 3677401 (1972-07-01), Chaparro et al.
patent: 3701021 (1972-10-01), Isaac et al.
patent: 3716786 (1973-02-01), Gearin
patent: 3824462 (1974-07-01), Vinsani
patent: 3896935 (1975-07-01), Hjelle et al.
patent: 4234418 (1980-11-01), Boissicat
patent: 4478352 (1984-10-01), Amundson et al.
patent: 4488354 (1984-12-01), Chan et al.
patent: 4510806 (1985-04-01), Janisiewicz et al.
"Module Test and Handling System"; IBM Technical Disclosure Bulletin; vol. 16, No. 11, pp. 3653-3654; L. D. House; Apr. 1974.

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