Device for protecting the edge connectors of printed circuit boa

Metal fusion bonding – Miscellaneous

Patent

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Details

118505, 228 39, 269254D, B23K 300

Patent

active

040687929

ABSTRACT:
A device is described for masking the gold connector tabs located along the edges of printed circuit boards to prevent the connectors from becoming solder coated during wave solder operations. The device is comprised of a pair of angle sections coupled to each other by tensioning means. The sections are easily applied to the circuit board assembly without scratching the gold contacts. Moreover, they provide stiffness to the board and a dam to prevent solder from flowing over the board and damaging the electrical components mounted thereon during wave soldering. The device is easily removable from the circuit boards after soldering and is reusable. Finally, the device of the present invention is characterized by long life, reasonable cost and ease of use.

REFERENCES:
patent: 2598610 (1952-05-01), Satz et al.
patent: 3759436 (1973-09-01), Foster et al.

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