Device for protecting film-mounted integrated circuits against d

Details Device for protecting film-mounted integrated circuits against d Device for protecting film-mounted integrated circuits against d

1983-08-18

1986-03-11

Davie, James W.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 84, 174 52FP, H01L 2350, H01L 2332, H03F 152

Patent

active

045757470

ABSTRACT:
For the purpose of protecting film-mounted, integrated circuits (micropacks) against destruction due to electrostatic charging, each micropack is inserted in a mounting frame after it is cut from the film strip, is fixed there and tested. Subsequently, a short-circuit frame having conductive elements which short the outer track structures of the micropack is placed into the mounting frame and fixed there. The micropack remains between the two frames until its final assembly. The short-circuit frame is removable and reuseable.

REFERENCES:
patent: 3027004 (1962-03-01), Gluck
patent: 3774075 (1973-11-01), Medesha
patent: 3784960 (1974-01-01), Bruckner
patent: 3820152 (1974-06-01), Booth
patent: 3967366 (1976-07-01), Birglechner et al.
patent: 4007479 (1977-02-01), Kowalski
patent: 4069496 (1978-01-01), Kowalski
patent: 4132856 (1979-01-01), Hutchison et al.
patent: 4249196 (1981-02-01), Durney et al.

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