Device for producing inductively coupled plasma and method...

Details Device for producing inductively coupled plasma and method... Device for producing inductively coupled plasma and method...

2006-08-15

2006-08-15

Vo, Tuyet Thi (Department: 2821)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With radio frequency antenna or inductive coil gas...

C156S345490, C315S111710, C315S111410

Reexamination Certificate

active

07090742

ABSTRACT:
A device for producing inductively coupled plasma and method thereof, wherein a coil is uniformly and dispersedly arranged on a lateral wall in a chamber, instead of the prior device of a permanent magnet mounted on an external wall of the chamber, and the coil is so disposed as to allow a magnetic field formed from the coil to be mutually reinforced at a central portion of the coil, such that charged particles created inside the chamber are effectively isolated relative to the lateral wall of the chamber, thereby enabling to produce plasmas of high density and high uniformity. Intensity and frequency of power source applied to the coil are adjusted to enable to adjust the density and uniformity of plasmas produced in the chamber according to required process characteristics in etching or depositing process using plasmas such that flexibility is provided to the process using the plasmas and design of new process can be free from restriction calling for process chamber configure. The present invention is simplified in structure thereof because of a permanent magnet being dispensed with, to thereby reduce the manufacturing cost greatly.

REFERENCES:
patent: 5680014 (1997-10-01), Miyamoto et al.
patent: 5897923 (1999-04-01), Tamura et al.
patent: 6071372 (2000-06-01), Ye et al.
patent: 2002/0170678 (2002-11-01), Hayashi et al.
patent: 6-226032 (1994-08-01), None
patent: 11-191553 (1999-07-01), None
patent: 11-251088 (1999-09-01), None
patent: 2000-208298 (2000-07-01), None
Lieberman et al.Principles of Plasma Discharges and Materials Processing. John Wiley & Sons, Inc, New York, pp. 433, 1994.

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