Device for processing a wire

Details Device for processing a wire Device for processing a wire

2004-10-21

2009-10-27

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S748000, C029S751000, C029S753000, C029S564400, C029S03300H, C029S03300H, C029S745000, C029S755000, C029S867000, C083S580000, C081S009510, C072S020100

Reexamination Certificate

active

07607217

ABSTRACT:
A wire processing unit has a crimp head moved in a “z” direction by an eccentric drive and a crimping tool arranged on the crimp head moves with it. The crimp head also moves a pin connected to a lowering unit that has a C-shaped bracket on which the gripper unit is arranged. When a crimping punch moves, the gripper unit is moved with it, and the wire-end held by a gripper pair is inserted into an upwardly-open conductor crimp and an insulation crimp respectively. A cutting head of a cutting unit cuts off the leading wire-end, removes the insulation, and separates contacts with defective crimp fastening from the wire-end.

REFERENCES:
patent: 3972218 (1976-08-01), Pawloski
patent: 4642873 (1987-02-01), Bower et al.
patent: 4730384 (1988-03-01), Frohlich
patent: 5265502 (1993-11-01), Hoffa
patent: 5711182 (1998-01-01), Yang
patent: 5842266 (1998-12-01), Ishiwata
patent: 5934161 (1999-08-01), Keene
patent: 6170153 (2001-01-01), Ichikawa
patent: 6246024 (2001-06-01), Hosaka
patent: 6289573 (2001-09-01), Imgrut
patent: 6327775 (2001-12-01), Oishi et al.
patent: 6520061 (2003-02-01), Fukuta et al.
patent: 43 25 356 (1994-09-01), None
patent: 0 989 637 (2000-03-01), None

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