Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
2005-12-27
2005-12-27
Flynn, Nathan J. (Department: 2826)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
C029S741000, C029S840000, C257S778000
Reexamination Certificate
active
06978534
ABSTRACT:
A pressure device for pressure bonding an IC chip on a circuit board includes an IC pressurizing member having a groove extending in a predetermined direction, and formed on a surface opposite to a surface abutting the IC chip. A columnar member is provided overlapped on the IC pressurizing member so as to bring an external surface thereof into contact within the groove of the IC pressurizing member. A pressure receiving member has a groove extending in a predetermined direction and overlapped on the IC pressurizing member so as to bring an external surface of the columnar member into contact within the groove thereof. An adjusting member adjusts parallelism between the IC pressurizing member and the pressure receiving member, and a fixing member fixes a relative position between the IC pressurizing member and the pressure receiving member.
REFERENCES:
patent: 5115545 (1992-05-01), Fujimoto et al.
patent: 6269999 (2001-08-01), Okazaki et al.
patent: 6559523 (2003-05-01), Schmid et al.
patent: 2000-68633 (2000-03-01), None
Andújar Leonardo
Flynn Nathan J.
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