Device for polishing outer peripheral edge of semiconductor...

Details Device for polishing outer peripheral edge of semiconductor... Device for polishing outer peripheral edge of semiconductor...

2005-07-26

2005-07-26

Hassanzadeh, P. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345120, C451S066000

Reexamination Certificate

active

06921455

ABSTRACT:
A polishing machine for a peripheral edge of a semiconductor wafer comprises a rotary mechanism2which rotates a stack1of semiconductor wafers4mounted thereon, and a polishing mechanism3which is arranged to be movable in the radial direction of the rotary mechanism2and polishes the peripheral edges of the rotating semiconductor wafers4by means of contactless polishing. Minute gaps s are formed between the rotary column10of the polishing mechanism3and the stack1of semiconductor wafers4, and polishing solution is drawn into these minute gaps s. The peripheral edges of the semiconductor wafers4are polished by means of contactless polishing, using polishing abrasive particles included in polishing solution.

REFERENCES:
patent: 4426151 (1984-01-01), Aguro et al.
patent: 5076026 (1991-12-01), Mizuguchi et al.
patent: 5128281 (1992-07-01), Dyer et al.
patent: 6280294 (2001-08-01), Miyamoto

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