Cutting – Other than completely through work thickness or through work... – Grooving
Reexamination Certificate
2005-08-23
2005-08-23
Goodman, Charles (Department: 3724)
Cutting
Other than completely through work thickness or through work...
Grooving
C083S879000, C083S854000, C083S558000, C083S563000, C125S023010
Reexamination Certificate
active
06931976
ABSTRACT:
A device for patterning an optical element includes a working platform, a linear cutting pedestal, at least a cutting tool, at least a weight sliding block and a shaft. An optical element to be patterned is carried on the working platform. The working platform is driven to move horizontally. The linear cutting pedestal is mounted above the working platform. An upper sliding track in which the weight sliding blocks can move back and forth and provide appropriate press forces to the cutting tools, is disposed at the top of the linear cutting pedestal. A lower sliding track in which the cutting tools can move back and forth and be adjusted to appropriate positions according to patterns desired for the optical element, is disposed at the bottom of the linear cutting pedestal. The shaft is positioned above the linear cutting pedestal and drives the linear cutting pedestal to move vertically. By means of a linear relative motion of the working platform to the linear cutting pedestal, the cutting tools at the bottom of the linear cutting pedestal cut out grooves on the optical element.
REFERENCES:
patent: 6239851 (2001-05-01), Hatazawa et al.
patent: 6398610 (2002-06-01), Inoue
patent: 6619175 (2003-09-01), Yoo
patent: 2002/0056355 (2002-05-01), Yoo
patent: 2002/0059860 (2002-05-01), Yoo
Goodman Charles
Ladas & Parry LLP
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