Device for passing a member through a sealed chamber wall

Details Device for passing a member through a sealed chamber wall Device for passing a member through a sealed chamber wall

1992-12-08

1995-01-10

Picard, Leo P.

Electricity: conductors and insulators

Insulators

Through wall or plate

H01B 1726

Patent

active

053809556

ABSTRACT:
A device is provided for passing a member through the wall of a sealed chamber. The member has an outer surface having a portion thereof which is substantially formed of metal. A flange has an opening therein which surrounds and is spaced from the metal portion of the member. A solder member completely fills the space between the flange opening and the metal portion of the member for creating a seal therebetween which is capable of maintaining a high pressure differential between opposite sides of the sealed chamber wall. The member is preferably a flat, multi-conductor electrical cable having thin, flat, copper shielding layers on the top and bottom thereof. The metal portion preferably includes a wedge-shaped copper member which surrounds the electrical cable and is intricately affixed to the shielding layers. The solder member is preferably a solder compound comprising 52 percent indium and 48 percent tin.

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Straty Argyrakis, "High Frequency/High Density/High Vacuum Transmission Line Interface" Connection Technology, Feb. 1991.
Straty Argyrakis, "High-Vacuum/High-Frequency/High-Density Flex Cable" IBM Technical Disclosure Bulletin, vol. 34, No. 2, Jul. 1991, pp. 158-160.
Charles E.T. White & Gregory P. Evans, "Choose The Right Alloy for Each Soldering Job" Research & Development, Indium Corporation of America.

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