Device for packaging integrated circuits

Details Device for packaging integrated circuits Device for packaging integrated circuits

1992-04-15

1993-08-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361784, 361785, 174 522, 174235, 257750, 257787, H05K 118

Patent

active

052354962

ABSTRACT:
The device comprises at least one printed circuit board (11,12) on which is fixed a heightening board (15) comprising at least one opening (16) for forming with the surface of the printed circuit board (12) located in facing relation to the opening, the bottom and the lateral walls of a cavity (17) for at least one integrated circuit (18) connected with the printed circuit carried by the board defining the bottom of the cavity by means of conductive wires (19). The cavity containing the integrated circuit is filled with a resin (22) completely covering the integrated circuit. The printed circuit board (11,12) is cut on its periphery along a line of through holes (23) provided with a metal coating (24) and connected to printed conductors of the board, metallized grooves (23,24) resulting from the cutting constituting connection terminals of the device.

REFERENCES:
patent: 5018051 (1991-05-01), Yamada et al.
patent: 5031069 (1991-07-01), Anderson
patent: 5150280 (1992-09-01), Arai et al.

Affiliated with

Also associated with

Rating

Device for packaging integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for packaging integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for packaging integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1730342