Device for non-destructive desoldering and removal of a modular

Details Device for non-destructive desoldering and removal of a modular Device for non-destructive desoldering and removal of a modular

1980-06-12

1983-01-04

Ramsey, Kenneth J.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

By fluid blast or suction

156584, 228 59, B23K 300

Patent

active

043669255

ABSTRACT:
A device for semi-automatic dismantling of a modular component which is soldered and attached to a substrate forming a printed circuit. The component to be dismantled is placed under a hot gas source while a force member applies a resilient thrust, the force member comprising a needle arranged to be placed at the base of the component. The needle is slightly bent to apply a biasing force before controlling the ejection of the hot gas to cause melting of the solder at the ends of the connecting pieces and melting of the adhesive layer by which the component is attached to the substrate.

REFERENCES:
patent: 3412451 (1968-11-01), Vieser et al.
patent: 3557430 (1971-01-01), Jones
patent: 3644980 (1972-02-01), Class, Jr. et al.
patent: 3661315 (1972-05-01), Helton
patent: 3735911 (1973-05-01), Ward
patent: 3868764 (1975-03-01), Hartleroad et al.
patent: 3969813 (1976-07-01), Minetti et al.

Affiliated with

Also associated with

Rating

Device for non-destructive desoldering and removal of a modular does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for non-destructive desoldering and removal of a modular , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for non-destructive desoldering and removal of a modular will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1579977