Device for mounting semiconductors

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Patent

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Details

73754, H01L 2306

Patent

active

047805722

ABSTRACT:
A device containing a semiconductor element having a substrate a cap over the substrate with a glass layer formed between the cap and the substrate providing a seal therebetween. Electrically conducting terminal members extend through the glass layer and connect with means for electrically connecting to the semiconductor element. A semiconductor mounting member is joined to the substrate and a semiconductor element having a coefficient of thermal expansion approximately equal to the semiconductor element mounted thereon.

REFERENCES:
patent: 4314225 (1982-02-01), Tominaga et al.

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