Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-07-28
2000-04-04
Kincaid, Kristine
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439330, H01R 909
Patent
active
060453699
ABSTRACT:
An improved device for mounting a semiconductor package when testing electrical characteristics of the semiconductor package is capable of reducing stress which is applied to the semiconductor package. The device includes a shaped body, a plurality of spaced-apart protrusions that vertically extend from a first pair of opposing upper sides of the body, a plurality of guide blocks that extend from a second pair of opposing upper sides of the body, and a plurality of leads that extend from the top surface of the body and down side surfaces of the body. The leads may include inner portions that extend inward from the first pair of opposing upper sides of the body, and outer portions that extend down the sides of the body. In addition, a plurality of guide hooks for holding a semiconductor package may be formed on upper surfaces of the protrusions and/or the guide blocks.
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patent: 4435724 (1984-03-01), Ralstin
patent: 5117330 (1992-05-01), Miazga
patent: 5428248 (1995-06-01), Cha
Hong Joon-Ki
Shin Myeong-Soo
Kincaid Kristine
LG Semicon Co. Ltd.
Ngo Hung V
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