Device for mounting component

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S740000, C029S741000

Reexamination Certificate

active

07337533

ABSTRACT:
An object of the present invention is to provide a component mounting apparatus and a component mounting method in which a movement time of a nozzle can be shortened so that production efficiency can be improved.There is provided a control means for controlling movement positions and movement timings of a nozzle elevating means and a nozzle moving means. The control means stores positions and heights of obstacles located between a component supply unit and a circuit board in advance. The control means moves down a nozzle in sync with the time when the nozzle has finished passing over each obstacle after an electronic component has been photographed by a component camera. Alternatively, the control means moves the nozzle in a path to avoid the obstacles. In addition, in a component mounting region, the nozzle moves at a component mounting region movement height and the component is mounted by the nozzle moved down from the component mounting region movement height. Accordingly, it is possible to shorten an elevating stroke of the nozzle (5). In addition, the nozzle can be elevated in an arc trajectory.

REFERENCES:
patent: 5566447 (1996-10-01), Sakurai
patent: 5839186 (1998-11-01), Onodera
patent: 5864944 (1999-02-01), Kashiwagi et al.
patent: 6036425 (2000-03-01), Seto
patent: 6408505 (2002-06-01), Hata et al.
patent: 7003872 (2006-02-01), Mimura et al.
patent: 9-214182 (1997-08-01), None
patent: 10-113826 (1998-05-01), None
patent: 11-261297 (1999-09-01), None
patent: 11-330786 (1999-11-01), None
patent: 2001-284898 (2001-10-01), None
patent: 2002-111284 (2002-04-01), None
Japanese Office Action dated Aug. 1, 2007.

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