Device for mounting chip-type electronic components on a substra

Metal working – Means to assemble or disassemble – Means to assemble electrical device

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Details

29743, 29759, 29809, 29834, 156556, 156566, 206329, 228 6A, 414131, B23P 1900

Patent

active

043935796

ABSTRACT:
A device for mounting leadless chip-type electronic components on a substrate. A mounting head includes a slide which is displaceable in a guide in a single direction between a loading position and an unloading position, and a suction device which is displaceable in a vertical direction only at the area of the unloading position. A component to be mounted, dispensed from a magazine or from a carrier strip, is transported by the slide from the loading position to the unloading position where the component is picked up and then moved down onto the substrate by the suction device. As a result of the controlled displacement of the components in only two directions, accurate and reproduceable positioning of the component is achieved.

REFERENCES:
patent: 2840892 (1958-07-01), Erdmann
patent: 3475805 (1969-11-01), Rottmann
patent: 3963456 (1976-06-01), Tsuchiya et al.
patent: 4298120 (1981-11-01), Kaneko et al.
patent: 4307832 (1981-12-01), Taki et al.
patent: 4327482 (1982-05-01), Araki et al.
patent: 4327483 (1982-05-01), Zemek et al.
patent: 4346514 (1982-08-01), Makizawa et al.

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