Device for measuring thickness and square resistivity of...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C324S525000

Reexamination Certificate

active

08054096

ABSTRACT:
A microelectronic device comprising one or several metallic levels provided with one or several superposed metallic interconnecting levels and at least one test structure:at least one metallic zone formed in at least one insulating zone, the metallic zone comprising:at least one first metallic portion through which a current will be injected and at least one second metallic portion through which said current will be extracted,at least one third metallic portion that will act as a first voltage measurement point, and at least one fourth metallic portion that will act as a second measurement point for said voltage,a plurality of insulating islands incorporated in said metallic zone,said structure also comprising:a plurality of metallic islands incorporated in the insulating zone and distributed around said metallic zone.

REFERENCES:
patent: 5636133 (1997-06-01), Chesebro et al.
patent: 6403389 (2002-06-01), Chang et al.
patent: 6635501 (2003-10-01), Rowland
patent: 0 813 239 (1997-12-01), None
patent: 0 825 644 (1998-02-01), None
patent: 96/15552 (1996-05-01), None
Guillaumond et al; “Analysis of resistivity in nano-interconnect: Full range (4.2-300K) temperature characterization”, Proc. of IITC 2003 conf., p. 132.
Van Der Pauw; “A Method of Measuring the Resistivity and Hall Coefficient on Lamellae of Arbitrary Shape”, Philips Technical Revue, vol. 20, No. 8, 1958 pp. 230-233.
Federspiel et al; “Accurate Method for Determination of Interconnect Cross Section”, 2005 IEEE, International Integrated Reliability Workshop 2005, pp. 133-134.
Van Der Pauw; “A Method of Measuring the Resistivity and Hall Coefficient on Lamellae of Arbitrary Shape”, Philips Research Reports, vol. 13, No. 1, 1958, pp. 1-9.
French Preliminary Search Report.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Device for measuring thickness and square resistivity of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for measuring thickness and square resistivity of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for measuring thickness and square resistivity of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4256199

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.