Device for joining substrates

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Work-secured and/or work-guided

Reexamination Certificate

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Details

C156S580000

Reexamination Certificate

active

10472676

ABSTRACT:
An apparatus is provided for joining together substrates, which have an inner hole, to form a substrate disk. An expandable element is introducible into the inner hole of at least two superimposed substrates. The element is expandable to such an extent that it can come into contact with the inner holes of both of the substrates to close off an intermediate space formed between the substrates relative to the environment. A substrate support is rotatable about an axis of rotation perpendicular to a support surface thereof. A centering device is rotatably coupled with the substrate support and is movable relative thereto in the direction of the axis of rotation. The expandable element is disposed, and is compressible, between the substrate support and the centering device.

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patent: WO 00/76752 (2000-12-01), None
JP 62124629, Patent Abstracts of Japan.
JP 63146265, Patent Abstracts of Japan.
JP 11273165, Patent Abstracts of Japan.
JP 01011038, Patent Abstracts of Japan.

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