Device for joining a two-dimensional compound workpiece

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means

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Details

156539, 156556, 156580, 12 1W, 12 52, 12122, 12123, 269 21, B32B 3100

Patent

active

052640698

ABSTRACT:
The device has a support plate (119) provided with drive means (112, 117) for at least one lower part, as well as a plurality of holding plates (85) arranged in one row with an upper receiving surface and a lower receiving surface (93, 94), respectively, for a plurality of upper parts. The holding plates (85) can be rotated through 180.degree. by means of a pivoting device (86, 87, 108) around a symmetrical horizontal axis (L3). After the upper parts have been placed on the holding plates (85), adhesive is applied to the edges of the upper parts, after which the holding plates (85) are pivoted through 180.degree.. The support plate (119) subsequently gathers the upper parts, which are now hanging down, while at the same time the next upper parts can be placed over the receiving surfaces of the holding plates (85), which [receiving surfaces] are now facing upward. The support plate (119) and the holding plates (85) are designed as suction plates that can be turned on and off.

REFERENCES:
patent: 3988993 (1976-11-01), Brophy
patent: 3996088 (1976-12-01), Crouch
patent: 4212699 (1980-07-01), Braunschweiler
patent: 4557134 (1985-12-01), Kuppinger
patent: 4629527 (1986-12-01), Livi et al.
patent: 5098508 (1992-03-01), Mattil

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