Device for interconnection and protection of a bare microwave co

Details Device for interconnection and protection of a bare microwave co Device for interconnection and protection of a bare microwave co

1989-03-21

1991-02-26

Hille, Rolf

357 74, 357 81, H01L 2302, H01L 2312, H01L 3902

Patent

active

049965883

ABSTRACT:
In order to interconnect an unprotected bare chip of MMIC (microwave monolithic integrated circuit), a ceramic substrate carries a double-face circuit. A network of microstrip lines which radiate from the center to the periphery is disposed on the first face of said double-face circuit. The bare MMIC chip and its microwave environment is fixed on the second face which is metallized as a ground plane. The microwave circuit is interconnected with the network of microstrips by means of plugged metallized holes. A sole-piece provided with a housing for the MMIC is fixed on the ground plane. The first face can carry self-protected components.

REFERENCES:
patent: 3290564 (1966-12-01), Wolff, Jr.
patent: 3927815 (1975-12-01), Mase et al.
patent: 4276558 (1981-06-01), Ho et al.
patent: 4423468 (1983-12-01), Gatto et al.
Patent Abstracts of Japan, vol. 6, No. 132 (E-119) [1010], Jul. 17, 1982; & JP-A-57 56 953 (Nippon Denki K.K.) 05-04-1982.
Patent Abstracts of Japan, vol. 5, No. 44 (E-50) [716], Mar. 24, 1981; & JP-A-55 166 941.
IBM Technical Disclosure Bulletin, vol. 24, No. 4, Sep. 1981, p. 2146, Armonk, N.Y., U.S.; N. Ainslie et al.: "Brazing preform for semiconductor package".
Patent Abstracts of Japan, vol. 8. No. 17 (E-223) [1454], Jan. 25, 1984; & JP-A-58 182 250 (Mitsubishi Denki K.K.) 10-25-83.
Patent Abstracts of Japan, vol. 10, No. 263 (E-435) [2319], Sep. 9, 1986; & JP-A-61 89 653 (Fujitsu Ltd) 05-07-86.

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