Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
1998-10-14
2001-03-20
Abrams, Neil (Department: 2839)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C294S064300
Reexamination Certificate
active
06204675
ABSTRACT:
The instant invention relates to a device for inserting at least one semiconductor component into a receiving portion, particularly into a test socket for testing the electric function of the semiconductor component.
During the final assembly process of semiconductor components, e.g. IC devices, the components are subjected to different testing processes. For the testing of the electric functions of the semiconductor components, it is required that their contact legs are brought into electric contact with the contact pins of a test station. The test station comprises a plurality of test sockets with receiving spaces formed therein. The receiving spaces are adapted to have the semiconductor components automatically inserted thereinto through a receiving opening. The semiconductor components to be tested are arranged in deepened receiving portions of a transport tray which will be moved into a position under a test head of the test station. The test head comprises a plurality of test sockets positioned according to the configuration of the deepened receiving portions of the transport tray. The receiving spaces of the test sockets are open on their downward sides so that the semiconductor components, when lifted out of the deepened receiving portions of the transport tray, are moved into the receiving spaces of the test sockets. This movement is performed by use of moving elements shaped as stamp-like projections arranged on a common support.
When the semiconductor components or the IC devices are lifted out of the deepened receiving portions of the transport tray and moved into the receiving spaces of the test sockets, a danger exists that the semiconductor modules or the test socket are damaged. Often, the orientation of the semiconductor modules in the transport tray relative to the test head is not exact enough to accomplish a positionally correct lifting of the semiconductor modules into the receiving spaces of the test sockets. Instead, it is only by the force of the stamp-like moving elements that the semiconductor components can be pressed into the desired position, out of which they can then be pushed through the receiving openings into the receiving spaces of the test sockets. In the process, it may occur that the contact legs of the semiconductor components are deformed by bending. Further, due to the massive friction caused by the semiconductor components, the test sockets will wear out relatively quickly and thus have to be replaced frequently.
It is an object of the invention to provide a device for inserting at least one semiconductor component into a receiving portion, wherein the danger of damage to the semiconductor component and/or the receiving portion is reduced.
For solving the above object, the instant invention provides a device for inserting at least one semiconductor component into a receiving portion, particularly into a test socket for testing the electric function of the semiconductor component, which device comprises
at least one receiving space for the semiconductor component, said receiving space having a receiving opening, and
at least one moving element for moving the semiconductor component in a moving direction through said receiving opening into said receiving space,
said moving element comprising a gas cushion generating means for generating a gas cushion adapted to lift the semiconductor component at least into said receiving opening.
The device according to the invention comprises, for each semiconductor component to be moved, a moving element provided with a gas cushion generating means. At least during the period of the movement of the semiconductor component—when the semiconductor component is moved into a position in the receiving opening—a gas cushion is arranged between the end of the moving element facing the semiconductor component and the semiconductor component itself. Thus, while the semiconductor component is moved into the receiving space from below, it is floating on the gas cushion until entering the receiving opening of the receiving space. Within the receiving opening, the semiconductor component is centered, with the semiconductor component moving relative to the moving element. Since the moving element does not yet mechanically abut the semiconductor component, the centering process for the semiconductor component is gentle both on the semiconductor component itself and on the receiving portion which, in case of an IC test station, is a test socket. This considerably reduces wear and the risk of damage.
Therefore, by use of the inventive device, semiconductor components, while being transferred into a receiving portion such as a test socket for testing the electric function of the semiconductor component, can be moved in a gentle manner by application of only a small force and at low friction. Depending on the respective design of the semiconductor component and the receiving portion, the complete insertion of the semiconductor component into the receiving space may require larger moving forces than can be generated by the gas cushion. This, for instance, is the case in test sockets for SOJ-ICs. In these test sockets, the contact legs of the IC device must be brought into mechanical contact with spring-biased contact lugs of a test socket. This requires a certain minimum force which possibly cannot be generated anymore in that the moving element with the gas cushion generated thereon is advanced towards the semiconductor component without touching the semiconductor component. Therefore, it may happen that, after the centering of the semiconductor component in the receiving space of the test socket for SOJ-ICs, the complete insertion of the SOJ-ICs into the test socket is performed by the moving element abutting the semiconductor component and inserting it into the test socket by advance movement.
A slightly different situation exists in the case of TSOP-ICs, which merely require that their contact legs are brought into abutment with abutment faces of the test socket; this is because the electrical contacting is performed by contacting elements which, by actuation of a corresponding actuating element of the test socket, are electrically contacted with the contact legs of the TSOP-ICs. In such an application of the gas cushion generating means according to the invention, the gas cushion should in any case be sufficient for moving the semiconductor component fully into the receiving space of a receiving portion without a mechanical contact with the moving element.
In a preferred embodiment of the invention, it is provided that the gas cushion generating means comprises at least one gas outlet orifice, which is formed in the front face—directed towards the semiconductor component—of the moving element assigned to the semiconductor component. Preferably, this gas outlet orifice is provided as a diffusor.
The diffusor is preferably formed as a spiral arranged in the gas outlet orifice.
Further, the gas cushion generating means is preferably provided with a gas flow generating means which is connected, via gas feed conduits, to the gas outlet orifices of the moving elements. Preferably, a plurality of moving elements are arranged on a common support to allow a simultaneous insertion of a plurality of semiconductor components into receiving portions assigned thereto. The gas feed conduits of the moving elements are connected to each other and coupled in common to the gas flow generating means.
In a preferred embodiment of the invention, it is further provided that the gas flow generating means is configured as a closed air circuit, thus returning the gas issuing from the gas outlet orifices to the gas feed conduits.
Basically, a large variety of fluids can be used for generating the gas cushion. However, the use of air is most suitable.
Preferably, the gas cushion generating means is provided with a heating/cooling means for tempering the gas forming the gas cushion. Such an arrangement offers the advantage that the onflow of tempered gas can be utilized to bring the to-be-tested semiconductor components to a desired temperature
Kremer Hans-Joachim
Moewes Harro
Abrams Neil
Birch & Stewart Kolasch & Birch, LLP
MCI Computer GmbH
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