Device for increased thermal conductivity between a printed...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S707000, C361S727000, C361S728000, C361S729000, C361S730000, C361S731000, C361S732000, C361S759000, C361S801000, C361S802000, C361S715000, C361S720000, C361S726000, C165S080200, C165S080300, C174S016300, C174S252000, C439S327000, C411S079000, C403S297000, C403S409100

Reexamination Certificate

active

07349221

ABSTRACT:
A floating guide device provides increased thermal conductivity between a printed wiring assembly and a heat sink chassis. The guide device includes an elongated thermally conductive rod and a wedgelock used in conjunction with the rod that can be attached to the rod. The guide device can be used in an electronic assembly comprising a chassis having at least one slot, and at least one printed wiring assembly with a printed wiring board disposed in the slot. At least one integrated circuit package is electrically attached to the printed wiring board. The printed wiring board provides a thermal path to the chassis. The guide device provides one or more additional thermal paths between the printed wiring board and the chassis.

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