Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Patent
1994-06-24
1996-01-23
Hoang, Tu
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
219385, 361690, F27D 704
Patent
active
054866812
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The present invention relates to a device for heating up electronic boards arranged in board-guides and between which a circulation of air is possible.
Generally, these electronic boards, whatever their dimensions, thickness, component technologies, etc. or their constituent substance, may be intended to operate inside electronic cabinets, computers or various other hardware. This hardware may be used in certain cases in harsh climatic environments and in particular at very low temperatures, possibly down to -55.degree. to 60.degree. C. Many components, and in particular the so-called non civilian components, do not operate or operate poorly at such temperatures. It is therefore necessary to raise their temperature to a value sufficient to allow the rapid start-up and correct operation of the electronic boards.
It is known in certain cases to provide each integrated circuit with its own heating means (resistor wire for example). However, such a solution is expensive since it requires the use of specially modified components.
The purpose of the present invention is to allow the heating up of standard electronic boards using conventional components without any modification.
A subject of the invention is therefore a device for heating up electronic boards which is simple by virtue of a suitable layout of the board-support and mounting assemblies.
SUMMARY OF THE INVENTION
According to the invention, there is therefore provided a device for heating up electronic boards mounted between opposing board-guide walls containing parallel guidance grooves and a back allowing for the interconnections, said device being characterized in that a heating element is arranged on at least one of the board-guide walls, on the opposite face to the grooves, in that convection means are associated with the heating element and in that said board-guide walls contain vents arranged between the grooves so as to allow for the circulation of the heated air between the electronic boards.
Thus, the device applies to any type of board without modification to the latter. Moreover, heat-up is all the more effective since it is undertaken from both sides of each board, thus enabling the components to be heated through the body and through the tabs, independently of the direction of mounting.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will be better understood and other characteristics and advantages will emerge with the aid of the description below and the attached drawings in which:
FIG. 1 is a perspective view of an embodiment of the device according to the invention;
FIG. 2 is a basic diagram of the device under natural convection;
FIGS. 3 and 4 show a basic diagram of the device under forced convection; and
FIG. 5 illustrates one part of a variant of the device according to the invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
FIG. 1 shows in perspective an assembly for mounting electronic boards, which is modified so as to constitute the heating-up device according to the invention.
Throughout the description, the term "electronic board" is understood as any type of board carrying a certain number of electronic components connected together to form a circuit, for example a printed-circuit board, whatever the dimensions, thickness, component technologies and constructional technologies and whatever the constituent substance of the board (glass epoxy, composite epoxy, polyamide ceramic, etc.). The electronic boards 8 are fitted for mounting and retention into guidance grooves 6 of opposing board-guide walls 2. These walls are connected to a back 4, motherboard or backplane, furnished with connectors 5 for receiving the corresponding male connectors of the boards. This back 4 is provided so as to allow for the necessary interconnections. In order to allow for the heating-up of the boards according to the invention, there is provision for arranging a heating element 1 on the board-guide walls 2 on the face away from the grooves. This element can be a resistive film or support or else a device
REFERENCES:
patent: 4374316 (1983-02-01), Inamori et al.
patent: 4985803 (1991-01-01), Pum et al.
patent: 5010233 (1991-04-01), Henschen et al.
patent: 5268558 (1993-12-01), Youssef et al.
Dagnac Pierre
Leviandier Michel
Tigneres Jean-Philippe
"Thomson-CSF"
Hoang Tu
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