Device for forwarding semiconductor lead frames and method of op

Details Device for forwarding semiconductor lead frames and method of op Device for forwarding semiconductor lead frames and method of op

1990-04-04

1992-01-21

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 62, H01L 2158

Patent

active

050821652

ABSTRACT:
A device for forwarding semiconductor lead frames to a heater unit having a fixed heater surface. The lead frame is clamped and lifted by a predetermined height by a pair of clamp lifters and forwarded by linear motion guides on which the clamp lifters are mounted. Each clamp lifter includes upper and lower jaws, a cam mechanism including a vertically sliding horizontal rail, a lower jaw holder vertically slidably mounted on a linear motion guide, a support block vertically slidably mounted on the linear motion guide, and an upper jaw holder rotatably mounted to the support block. The cam mechanism varies the height of the sliding rail to three distinct levels, and thus effects the clamping and lifting operations of the clamp lifter.

REFERENCES:
patent: 3698620 (1972-10-01), Geyer et al.
patent: 4558809 (1985-12-01), Schoen
patent: 4763827 (1988-08-01), Watanabe et al.

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