Device for forming solder connections

Electricity: conductors and insulators – Conduits – cables or conductors – Combined

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29872, 174 77R, 174 88R, 174DIG8, H01R 402, H01R 4302

Patent

active

046544739

ABSTRACT:
This invention relates to heat-shrinkable devices for forming solder connections between electrical conductors. The devices each comprise of a hollow, heat-shrinkable sleeve having first and second ends, and contain a quantity of solder. Both ends contain heat-softenable sealing material which seal the ends upon recovery of the article, the sealing material at the second end being less responsive to heat than the sealing material at the first end. The conductors to be connected are inserted into the first end of the sleeve and the sleeve recovered. Because the sealing material at the second end does not seal the second end until after the sealing material at the first end has recovered about the inserted conductors at the first end, any hot gases evolved within the article can exit the article via the second end. The invention enables a reliable connection to be made between electrical conductors that are provided with heat-sensitive insulation.

REFERENCES:
patent: 2027962 (1933-03-01), Currie
patent: 3086242 (1963-04-01), Cook et al.
patent: 3239125 (1966-03-01), Sherlock
patent: 3243211 (1966-03-01), Wetmore
patent: 3525799 (1970-08-01), Ellis
patent: 3597372 (1971-08-01), Cook
patent: 4060887 (1977-12-01), De Groef
patent: 4251304 (1981-02-01), Campbell et al.
patent: 4282396 (1981-08-01), Watine et al.
patent: 4283596 (1981-08-01), Vidakovits et al.
patent: 4288471 (1981-09-01), Lanier
patent: 4292099 (1981-09-01), Dinger
patent: 4504699 (1985-03-01), Dones et al.
patent: 4553809 (1985-11-01), Holt

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Device for forming solder connections does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for forming solder connections, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for forming solder connections will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2213974

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.