Device for forming heat dissipating fin set

Details Device for forming heat dissipating fin set Device for forming heat dissipating fin set

2001-04-16

2002-05-07

Bennett, Henry (Department: 3743)

Heat exchange

With retainer for removable article

Electrical component

C165S104330, C165S185000, C361S697000, C361S700000, C361S709000, C257S706000, C257S715000

Reexamination Certificate

active

06382307

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a device for forming a heat dissipating fin set, and especially to a forming structure in that the heat dissipating fin set and heat tube are tightly combined together without any interface heat resistance, and thus it has a preferred heat conductance.
BACKGROUND OF THE INVENTION
In the prior art, heat tubes are used. Interiors of the heat tubes are formed with proper wick structures. By the capillary function of the wick structure, the working fluid in the heat tube may be transferred easily. The heat tube can be connected to a central processing unit (CPU) of a computer mainframe, or other high temperature chip, or other heat emitting elements so that the heat interior the heat emitting element can be guided out through the heat tube. Therefore the heat emitting element (for example, a CPU) may work normally.
Referring to
FIG. 1
, an exploded perspective view of a prior art device for forming a heat dissipating fin set and heat tube is illustrated. The device for forming a heat dissipating fin set and heat tube is formed by a heat tube
1
a
and a heat dissipating fin set
2
. Each fin
2
a
is engage to the heat tube
1
a
through a through hole
3
a
and a combining portion
4
a.
In order to enhance the heat dissipating effect of the heat tube
1
a,
a plurality of fins
2
a
can be engaged to the heat tube
1
a
for increasing the heat dissipating area. Since the heat dissipating fin set
2
a
is fixed to the heat tube
1
a
by tightly matching, or a heat conductive glue is used to combine the heat dissipating fin set
2
a
and heat tube
1
a,
the tightness therebetween is bad and the interface heat resistance will increase. Therefore the heat transferring efficiency is not good.
SUMMARY OF THE INVENTION
Accordingly, the primary object of the present invention is to provide a device for forming a heat dissipating fin set. A heat tube and a heat dissipating fin set are made of copper which has good extension ability and heat conductance. The extension ability and heat conductance of copper are better than those of aluminum. Furthermore, the heat resistance of copper is better than aluminum. The heat tube and heat dissipating fin set are formed integrally by melting silver, tin or copper. This combination way is better than the prior art in that the heat dissipating fin set is firmly secured to the heat tube. In the present invention, the heat tube is almost completely engaged to and heat dissipating fin set. Moreover, in the present invention, the heat dissipating fin set and heat tube are not glued together through heat conductive glue. It has no heat resistance and thus has a preferred heat conductance.
The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing.


REFERENCES:
patent: 1841380 (1932-01-01), Phelps et al.
patent: 2585912 (1952-02-01), Buschow et al.
patent: 2959402 (1960-11-01), Edwards
patent: 3141999 (1964-07-01), Schneider
patent: 3246213 (1966-04-01), Hannan
patent: 4648443 (1987-03-01), Szucs et al.
patent: 5509465 (1996-04-01), Lai
patent: 5947192 (1999-09-01), Kuo
patent: 6006827 (1999-12-01), Lu
patent: 6289975 (2001-09-01), Kuo

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