Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Patent
1990-10-26
1992-04-28
Rowan, Kurt
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Plural discrete workpieces
269254R, 269903, 228 447, 228 11, B23K 3704, B23K 106
Patent
active
051080230
ABSTRACT:
The present invention relates to a device for forming electric circuits on a lead frame, which has a plurality of process points in a row, each of which is provided with a semiconductor chip. During bonding, for achieving an optimum ultrasonic power transfer necessary for the electric connection of the semiconductor chip (8) to the connection fingers (5) of the lead frame, the individual lead frame (1) is located between a heated bearing element (19) and a correspondingly constructed holding plate (40). In the case of the device (50) according to the invention, the holding plate (40) provided for a contacting member (transducer) with a correspondingly constructed window-like recess (45) is movably mounted relative to the bearing element (19) about at least one axis (S) oriented in the longitudinal direction of the holding plate (40) on two spaced studs (35, 35'), each of which is arranged on a spring element (34, 34'). The axis (S) passes through the center of the recess (45) and interconnects the two studs (35, 35' ).
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Japichino Emanuele
Nehls Walter
ESEC SA
Evens Carl J.
Knapp Jeffrey T.
Rowan Kurt
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