Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1998-03-23
2000-02-29
Gorgos, Kathryn
Chemistry: electrical and wave energy
Apparatus
Electrolytic
204275, 204297R, 205133, C25D 508
Patent
active
060305126
ABSTRACT:
Bumps are formed by means of uniform plating in which air can be easily discharged. A plating device comprises: a plating tank 32; a holding jig 34 detachably attached to an object 35 to be plated, the holding jig 34 being connected with a cathode and electrically connected with the object 35 to be plated, the object 35 to be plated being dipped in a plating solution, by the holding jig 34, substantially vertically or obliquely to the surface of the plating solution in the plating tank so that the surface to be plated can be directed upward; a cylindrical body 39 made of insulating material arranged in the front of the object 35 to be plated held by the holding jig 34 while a short clearance is left between the cylindrical body 39 and the surface to be plated and an axial line of the cylindrical body 39 is substantially perpendicular to the surface to be plated; an anode plate 37 arranged in the cylindrical body 39 being opposed to the surface of the object 35 to be plated; and a nozzle 40 arranged in the cylindrical body 39 while it penetrates the anode plate 37 and the plating solution is jetted onto the surface to be plated from the nozzle end section located in the cylindrical body 39.
REFERENCES:
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patent: 5421987 (1995-06-01), Tzanavaras et al.
patent: 5597110 (1997-01-01), Melton et al.
Yu KK et al: "Soler Bump Fabrication By 1-3 Electroplating For Flip-Chip Applications" Proceedings Of The International Electronics Manufacturing Technolo Symposium, Santa Clara, Oct. 4-6, 1993, No. SYMP. 15, Oct. 4, 1993, pp. 277-281, Institute of Electrical and Electronics Engineers.
Yung E K et al. "Electroplated Solder Joints for Flip-Chip Applications", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 14, No. 3, Sep. 1, 1991, pp. 549-559.
S. Watanabe et al. "Solder Bump Fabrication on Wafers By Electroplating Process", Proceedings of 1997 First International Electronic Manufacturing Technology, Apr. 16-18, 1997, pp. 110-115, Japan.
Ihara Yoshihiro
Kanazawa Takeo
Kobayashi Tsuyoshi
Gorgos Kathryn
Leader William T.
Shinko Electric Industries Co. Ltd.
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