Device for forming a solder connection

Details Device for forming a solder connection Device for forming a solder connection

1989-06-20

1990-07-10

Godici, Nicholas P.

Metal fusion bonding

Solder form

174 84R, 174DIG8, H01R 470, B23K 300

Patent

active

049401793

ABSTRACT:
A device for connecting two bodies such as wires, and for sealing the connection between them, comprising a heat-shrinkable sleeve, a solder insert and an annular composite adhesive insert which comprises two layers of heat-activatable adhesive material. The viscosity of the radially inner layer is less than that of the outer layer. The device is heated to cause the sleeve to shrink and to cause the solder to fuse to form a connection between the bodies. Flow of the inner, less viscous layer of the adhesive insert is restricted by the outer viscous layer, to minimize contamination of the solder by the material of the inner layer.

REFERENCES:
patent: 3525799 (1970-08-01), Ellis
patent: 3578896 (1971-05-01), Lynch
patent: 4144404 (1979-03-01), DeGroef et al.
patent: 4722471 (1988-02-01), Gray et al.
patent: 4832248 (1989-05-01), Soni et al.

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