Device for flux-free soldering

Details Device for flux-free soldering Device for flux-free soldering

1995-08-29

1998-06-09

Heinrich, Samuel M.

Metal fusion bonding

Specialized pot

Having means to treat flux or filler

228 37, 228262, 118429, H05K 334, B23K 306

Patent

active

057622574

ABSTRACT:
The present invention pertains to a device for the flux-free soldering of printed circuit boards guided over the soldering wave of a wave soldering nozzle, wherein the solder is vibrated by means of at least one ultrasonic electrode (sonotrode), the surface of the sonotrode is directly rinsed by the soldering wave, and the printed circuit boards are guided just above the surface of the sonotrode. It is provided that the surface (12, 28) of the sonotrode (5, 21) forms at least a partial area of the surface of the wave former (11, 13) of the wave soldering nozzle (2, 22).

REFERENCES:
patent: 3266136 (1966-08-01), Gutbier
patent: 3303983 (1967-02-01), Patrick et al.
patent: 3536243 (1970-10-01), Higgins
patent: 3762368 (1973-10-01), Strube et al.
patent: 3966110 (1976-06-01), Boynton
patent: 5228614 (1993-07-01), Elliot et al.
"Fluxloses Ultraschall-Lotsystem" (Sales Brochure).
R. J. Klein Wassink 1991 Weichloten in der Elecktrotechnik.

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