Device for fitting a substrate with a flip chip

Details Device for fitting a substrate with a flip chip Device for fitting a substrate with a flip chip

2006-04-18

2006-04-18

Chang, Richard (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S832000, C029S792000, C414S737000, C414S751100, C414S752100, C901S040000, C294S064200

Reexamination Certificate

active

07028392

ABSTRACT:
A freely positionable placement head (1) removes presented flip chips (6) from a wafer (5), the connection side of said chips being directed upward. The placement head has a turning device (9), in which, by the time they are placed onto a substrate (8) to be provided with placed components, the flip chips are turned in such a way that they can be placed with their connection side onto the substrate.This makes it possible to dispense with a complex turning device assigned to the wafer (5).

REFERENCES:
patent: 4143776 (1979-03-01), Meyers et al.
patent: 4915565 (1990-04-01), Bond et al.
patent: 5501005 (1996-03-01), Onitsuka
patent: 5586387 (1996-12-01), Nakatani et al.
patent: 5667129 (1997-09-01), Morita et al.
patent: 5671530 (1997-09-01), Combs et al.
patent: 5839187 (1998-11-01), Sato et al.
patent: 5952841 (1999-09-01), Hiruta
patent: 0895450 (1999-02-01), None
patent: 60-16433 (1985-01-01), None
patent: 62-26833 (1987-02-01), None
patent: 01-61027 (1989-03-01), None
patent: 02-56944 (1990-02-01), None
patent: 02-226737 (1990-09-01), None
patent: 03-29334 (1991-02-01), None
patent: 08-227904 (1996-09-01), None
Spur, G., Handbuch der Fertigungstechnik, Bd. 5, Fügen, Handhaben und Montiersen, Seite 713 bis 719, Carl Hanser Verlag, München, ISBN 3-446-12536-1.

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