Device for fastening together under pressure two pieces, one to

Heat exchange – With repair or assembly means

Patent

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Details

165185, 165 803, 361386, 403404, 411909, F28F 700, H01L 2340

Patent

active

050109499

ABSTRACT:
A heat sink of a circuit package for high density integrated circuits is fastened by a spring element that has shape memory. The fastening is carried out in a manner so that the element can be easily removed for disassembly.

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