Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1997-02-27
1999-05-04
Do, Diep N.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
3241581, 257758, G01R 3102, H01L 23528
Patent
active
059007354
ABSTRACT:
Center-to-center spacings (L.sub.1, L.sub.2, L.sub.3, L.sub.4, . . . ) of adjacent holes (5) in a hole chain (6) are set to values not less than five times a Blech length. This setting causes two parameters (MTF and .sigma.) of a logarithmic normal distribution used as a failure distribution for EM lifetime prediction to be constant independently of the center-to-center spacings, permitting stable EM lifetime prediction of the hole chain. Further, setting the length of each of extension interconnect wires (2) to a value not greater than the Blech length prevents voids from being created in the extension interconnect wires (2).
REFERENCES:
patent: 4652812 (1987-03-01), Gimpelson et al.
patent: 5049811 (1991-09-01), Dreyer et al.
patent: 5382831 (1995-01-01), Atakov et al.
patent: 5514974 (1996-05-01), Bouldin
patent: 5612627 (1997-03-01), Bui et al.
patent: 5689139 (1997-11-01), Bui et al.
patent: 5712510 (1998-01-01), Bui et al.
I. A. Blech, "Electromigration In Thin Aluminum Films On Titanium Nitride", Journal Of Applied Physics, vol. 47, No. 4, Apr. 1976, pp. 1203-1208.
Do Diep N.
Mitsubishi Denki & Kabushiki Kaisha
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