Device for dismounting integrated circuit devices

Metal working – Means to assemble or disassemble – Means to assemble electrical device

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Details

29764, 219229, 228 55, 228264, H01R 4302, B23P 1904

Patent

active

045287465

ABSTRACT:
A device for dismounting an integrated circuit package soldered on a printed electric circuit board by melting the solder, including an electric heater which heats a heating shank disposed so as to contact upper portions of soldered portions of a plurality of leads soldered to circuit ends on an electric circuit board wherein the leads extending from side walls of an IC package mounted on the board. A suction cup member is disposed in a center portion of the heating shank so as to face an upper surface of the IC package and dismount the IC package sucked thereby from the board after melting the solder.

REFERENCES:
patent: 2261015 (1941-10-01), Brody
patent: 3382564 (1968-05-01), Gallentine
patent: 3990863 (1976-11-01), Palmer
patent: 4295596 (1981-10-01), Doten

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