Device for decreasing the temperature from address IC of...

Details Device for decreasing the temperature from address IC of... Device for decreasing the temperature from address IC of...

2007-08-28

2007-08-28

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S713000, C361S714000, C361S719000, C349S059000

Reexamination Certificate

active

11011056

ABSTRACT:
A device for dissipating a heat from addressing integrated circuits (addressing ICs) of a plasma display panel that uses a back plate which has a greater surface area, to dissipate the heat from the addressing integrated circuits directly. For embodiment of the device thereof, it provides a heat-conducting sheet attached on the addressing ICs to conduct the heat from the addressing ICs to the back plate rapidly, therefore increase the efficiency of the dissipation without add the volume of the plasma display panel.

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