Device for cutting a wire laid on a substrate

Details Device for cutting a wire laid on a substrate Device for cutting a wire laid on a substrate

1996-09-03

1998-10-27

Rachuba, Maurina T.

Cutting

With means to convey work relative to tool station

Cut made parallel to direction of and during work movement

83923, 839292, 30180, 30182, B26D 706

Patent

active

058264736

ABSTRACT:
A continuous strand of wire is laid in a wire groove or between pairs of guides on a substrate and is cut at desired locations to form individual circuits. At least one recess below the level of the wire laying plane is positioned to correspond to a scrap wire portion to be cut off. The recess is wide enough to allow insertion of cutters. The cutters include pairs of first and second cutting blades located at opposite sides of the wire which are moved toward the wire so that both ends of the scrap wire portion are cut by the first cutting blades and by the second cutting blades, respectively.

REFERENCES:
patent: 596066 (1897-12-01), Helwig
patent: 1373861 (1921-04-01), Briles
patent: 1385481 (1921-07-01), Williams
patent: 1592017 (1926-07-01), Van Campen
patent: 4125136 (1978-11-01), Olcese et al.
patent: 4360043 (1982-11-01), Maeda et al.
patent: 5058272 (1991-10-01), Steube
patent: 5072638 (1991-12-01), Huser
Patent Abstracts of Japan, 05227631, Sep. 3, 1993 (1 pg.) Tatsumi.

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