Metal fusion bonding – With means to handle work or product
Patent
1989-01-18
1990-04-03
Seidel, Richard K.
Metal fusion bonding
With means to handle work or product
228 57, 2281801, 295663, B23K 3704
Patent
active
049133349
ABSTRACT:
A device for correcting warp of printed circuit boards in carrierless soldering apparatus wherein the printed circuit boards are soldered while being held by holding claws of a conveying means is disclosed, which comprises a sliding means involving a single or plural warp-correcting means, sliding plates for installing the warp-correcting means thereon, and a single or plural pairs of slide beds provided in parallel to the direction of movement of the printed circuit boards, and a driving means for reciprocating the slide means in parallel to the direction of movement of the printed circuit boards.
REFERENCES:
patent: 4408560 (1983-10-01), Caratsch
patent: 4620663 (1986-11-01), Odashima et al.
patent: 4769083 (1988-09-01), Tiritilli
patent: 4807794 (1989-02-01), Hess
Heinrich Samuel M.
Nihon Den-Netsu Keiki Co. Ltd.
Seidel Richard K.
Yee Stephen F. K.
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