Device for cooling semiconductor elements

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

357 81, 361386, 228110, H01L 2512, H05K 720

Patent

active

045464090

ABSTRACT:
A device for cooling semiconductor elements is constituted by a plate for cooling semiconductor elements, the plate being made of aluminum or an aluminum alloy, and a semiconductor element-mounting sheet which is made of aluminum or an aluminum alloy, the sheet having on one surface thereof a metal layer to which solder can be applied as desired, and the other surface of the sheet being secured by ultrasonic welding to the plate in a recessed portion formed in the cooling plate by ultrasonic welding.

REFERENCES:
patent: 3662454 (1972-05-01), Miller
patent: 3670394 (1972-06-01), Daniels et al.
patent: 4023725 (1977-05-01), Ivett et al.
patent: 4057825 (1977-11-01), Narita et al.
patent: 4142662 (1979-03-01), Holbrook et al.
patent: 4360142 (1982-11-01), Carpenter et al.
patent: 4417267 (1983-11-01), Wada et al.

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