Device for cooling memory modules

Details Device for cooling memory modules Device for cooling memory modules

2006-04-04

2006-04-04

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S715000, C361S716000, C361S695000, C174S016100, C174S016300, C165S080300, C165S185000

Reexamination Certificate

active

07023701

ABSTRACT:
A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact areas bearing in a planar manner.

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