Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1986-02-10
1987-08-11
Tolin, G. P.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
165 804, 357 82, H05K 720
Patent
active
046866060
ABSTRACT:
A cooling structure for cooling a multichip module for effectively removing heat generated from integrated circuit chips. A suction plate formed with minute grooves on one of its surfaces is disposed between each integrated circuit chip and an associated cooling block and is brought into contact at a grooved surface with the integrated circuit chip through a layer of a liquid such as silicone oil interposed therebetween, thereby producing negative hydrostatic pressure by capillary action of the minute grooves. The suction plate has a thickness small enough to be bent under influence of the negative hydrostatic pressure to follow a warping of the integrated circuit chip, so that the clearance between the opposing surfaces of the suction plate and the integrated circuit chip can be minimized. Thus, an integrated circuit chip cooling device of surface-to-surface contact type operable with a low thermal resistance is provided, which can improve the maintainability and reliability without sacrificing the cooling efficiency.
REFERENCES:
patent: 4558395 (1985-12-01), Yamada
patent: 4567505 (1986-01-01), Pease
Balde, Res., IBM Tech Discl Bull, vol. 20, No. 11A, Apr. 1978, p. 4336, "Liquid Cooling of-Package".
Bergles, IBM Tech Discl. Bull, vol. 22, No. 8A, Jan. 1980, p. 3318, "Two-Piece Cold Plate-Surface".
Berndlmaier, IBM Tech Discl. Bull, vol. 20, No. 11B, Apr. 1978, p. 4817, "Liquid-Metal-Cooled-Structures".
Electronics (Jun. 16, 1982), vol. 55, No. 12, p. 143, "Thermal-Chips", Barbour.
"Microcapillary Thermal Interface Technology for VLSI Packaging", David B. Tuckerman and R. Fabian Pease.
Masaki Akira
Nakanishi Keiichirou
Tokuda Masahide
Usui Mitsuru
Yamada Minoru
Hitachi , Ltd.
Tolin G. P.
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