Device for cooling central processing units

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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174 163, H05K 720

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active

058644652

ABSTRACT:
A device for cooling microprocessors includes a heat sink having a plurality of fins, a printed circuit board mounted on the heat sink, a fan mounted on the heat sink, a temperature sensor electrically connected to the printed circuit board, and a 12-pin ribbon cable connecting the printed circuit board to a main board, whereby when the temperature of the microprocessor picked up by the temperature sensor exceeds a predetermined value, the printed circuit board will send signals to the main board, loudspeaker and the first fan via the third, sixth and eleventh pins of the ribbon cable thereby informing the operator of the overheat of the microprocessor and therefore preventing the microprocessor from burning out.

REFERENCES:
patent: 4756473 (1988-07-01), Takemae et al.
patent: 5101321 (1992-03-01), Remise et al.
patent: 5457342 (1995-10-01), Herbst, II
patent: 5734554 (1998-03-01), Mitty et al.
IBM Technical Disclosure Bulletin "Variable-Speed Cooling assembly for a Processor Chip" vol. 38, No. 08, pp. 613-614, Aug. 1995.

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