Device for cooling a plurality of integrated modules combined on

Details Device for cooling a plurality of integrated modules combined on Device for cooling a plurality of integrated modules combined on

1983-08-25

1985-05-14

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361398, H05K 720

Patent

active

045176248

ABSTRACT:
Integrated modules are disposed on a flexible printed circuitboard. The entire rear surface of each module is in contact with a common cooling plate and the individual contact pressure of the individual integrated modules against the cooling plate occurs by way of resilient elements respectively inserted between the printed circuitboard and the modules.

REFERENCES:
patent: 3896544 (1975-07-01), Fosnough
patent: 3993123 (1976-11-01), Chu et al.
patent: 4104728 (1978-08-01), Kasubuchi
patent: 4180828 (1979-12-01), Schermer et al.
patent: 4358785 (1982-11-01), Takigami et al.
Arnold, "IBM Technical Disclosure Bulletin", vol. 21, No. 4, 9/78, pp. 1473-1474.
Doo et al., "IBM Technical Disclosure Bulletin", vol. 21, No. 2, 7/79, pp. 585-586.
Wanesky, "Western Electric Technical Digest", No. 18, 4/70, pp. 41-42.

Affiliated with

Also associated with

Rating

Device for cooling a plurality of integrated modules combined on does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for cooling a plurality of integrated modules combined on, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for cooling a plurality of integrated modules combined on will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-771752