Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-12-08
2001-11-27
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C361S690000, C361S695000, C361S752000, C165S080300, C174S016300
Reexamination Certificate
active
06324056
ABSTRACT:
BACKGROUND OF THE INVENTION
The invention is directed to a device for cooling a personal computer accommodated in a housing.
Due to the development of heat of their components, personal computers are equipped with cooling measures. Modules that are especially heat-critical are the microprocessor module, the drives, the power supply assembly and expansion assemblies, which are usually fashioned in the form of plugin cards. In a way that is currently standard, the inside of the housing of the personal computer and, in particular, the critical PC components are respectively actively force-aerated by one or more aerators or fans respectively driven by an electric motor and are thus adequately cooled for operation of the computer.
The aerators that are utilized, however, are accompanied by certain disadvantages. Due to mechanical wear and the blocking possibility of the rotating 15 parts, there is always a considerable outage risk that is sometimes countered by additionally provided alarm devices.
Given outage of an aerator, this must either be repaired or replaced, which requires service outlay, entirely apart from the fact that the installation of one or more aerators already involves a considerable cost outlay. Further, the aerators provided in the computer require additional space, as a result whereof a space requirement of the personal computer that is larger overall is incurred.
Finally, one disadvantage in the employment of motor-driven aerators for cooling in the computer is that a considerable noise level is produced that negatively influences direct work at the computer and, over and above this, also complicates and disturbs activities in rooms in which one or more PCs are located.
SUMMARY OF THE INVENTION
The invention is therefore based on the object of specifying measures for cooling a personal computer and, in particular, the heat-critical components thereof such as the microprocessor module, the drives, the power supply and expansion assemblies, so that specific boundary conditions are adhered to, namely the realizability of the cooling measures in arbitrary PC housings, particularly in flat desktops, a minimization of the noise level, a maximization of the outage dependability and an adequate cooling capacity for high-performance microprocessors up to approximately 50 Watts.
To accomplish these objects, the device of the present invention has one or more of the following features:
a) a location for the microprocessor module on the system assembly is arranged so that a thermally conductive connection is produced from the microprocessor module to a cooling member;
b) the housing floor has perforations and the housing cover is arranged in the form of a slanting plane placed obliquely, so that an air stream is generated that emerges from the housing through device openings placed at suitable locations in the housing;
c) the plugin locations for the acceptance of the expansion assemblies are arranged obliquely, so that an air stream is generated along the expansion assemblies proceeding in the form of slanting planes, and the air stream emerges from the housing through device openings placed at suitable locations in the housing;
d) the drives are arranged in the full air stream so that each and every one of these drives receives adequate air with the assistance of channels;
e) the power components of the power supply assembly are arranged on a cooling member; and
f) the power supply assembly is arranged in the air stream created by the perforations in the housing floor, the oblique cover and device openings.
A device comprising combination features of the invention effects a passive cooling by thermal conduction, convection and chimney effects. The invention is formed of a feature combination that defines various points of the system design.
The placement of the microprocessor module at a defined location on the system assembly recited in combination feature a), preferably at the edge of this assembly, is not trivial and is not comparable to solutions known from amplifier or power supply technology since the processor is connected and operated via several hundred high-frequency signals.
Compared to cooling devices currently realized in PCs with one or more aerators, or fans the measures according to the invention yield critical advantages. The outage dependability is considerably enhanced since a mechanical wear and a blocking of rotating parts are eliminated. The technical and cost-oriented outlay for a personal computer is reduced since an equipping with aerators or fans is eliminated.
The service outlay during the useful life of a computer is also greatly reduced since no aerator failures with their serious consequences can occur. With respect to the noise generated by the personal computer, the application of the measures indicated by the invention yields a noticeable reduction of the noise level, since motors and aerators producing air movement and noises are no longer required.
Given the device of the invention, thus, cooling possibilities that were hitherto unknown in PC technology are utilized. The cooling effect is optimized under the boundary conditions or a possible, low desktop set, of a minimal sound creation as well as a maximum service life and outage dependability of the personal computer.
The microprocessor is arranged at the edge of the system so that a direct connection, such as by a heat or transmission element to the cooling member, which is part of an outside wall of the housing, can be obtained.
Other features and advantages of the invention will be apparent from the claims, description of the preferred embodiment and drawings.
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Breier Anton
Luplow Werner
Riebel Michael
Schröder Stefan
Datskovsky Michael
Picard Leo P.
Schiff & Hardin & Waite
Siemens Aktiengesellschaft
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