Device for connecting leadless integrated circuit package to a p

Details Device for connecting leadless integrated circuit package to a p Device for connecting leadless integrated circuit package to a p

1975-02-04

1976-02-24

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 52FP, 317101CC, 339 17CF, 324158F, 357 68, H01L 2302, H02B 104, H05K 100

Patent

active

039407861

ABSTRACT:
This invention relates to a device which electrically connects a leadless integrated circuit package to a printed circuit board. More particularly, the device includes a square frame having a plurality of contacts arranged along each side of the housing. The lower end of the contact electrically engages a circuit on the printed circuit board and the upper end electrically engages a circuit on the package. The frame further contains positioning and support clips which permits alignment of the package before engagement is made with the contacts.

REFERENCES:
patent: 3757271 (1973-09-01), Judge et al.

Affiliated with

Also associated with

Rating

Device for connecting leadless integrated circuit package to a p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for connecting leadless integrated circuit package to a p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for connecting leadless integrated circuit package to a p will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2082912